Prediction Of Fatigue Life Of Solder Joints Under Random Vibrations Using Numerical Simulation

Document Type : Primary Research paper

Authors

1 Assistant Professor, Departtment of Production Engineering, PSG College of Technology, Coimbatore and 641004, India

2 Professor, Department of Production Engineering, PSG College of Technology, Coimbatore and 641004, India

3 PG student, ME Manufacturing Engineering,PSG College of Technology, Coimbatore and 641004, India

Abstract

Electronic devices are increasingly used in severeengineering environments such
as automotive, aerospace and defence. It can be subjected to many different forms of
vibration over wide frequency ranges and acceleration levels. Apart from the extreme
temperature and possibly high humidity, vibration can also be major cause of failure of
these components. The test vehicles for the vibration tests consist of twelve Ball Grid Array
(BGA) components with built-in daisy-chained circuits, which was assembled on centre of
a printed circuit board (PCB). First three mode shapes and their corresponding natural
frequencies were obtained from modal analysis using finite element analysis. Random
vibration analysis was performed by giving Power Spectral Density (PSD) values as input
to numerical simulation. Fatigue life of the BGA144 solder joints was predicted by
Stenberg equation.

Keywords

Int. J. of Aquatic Science
Volume 12, Issue 2 - Serial Number 2
June 2021
Pages 3845-3856

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